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Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow

Abstract : Electroless plating in micro-channels is a rising technology in industry. In many electroless plating systems, hydrogen gas is generated during the process. A numerical simulation method is proposed and analyzed. At a micrometer scale, the motion of the gaseous phase must be addressed so that the plating works smoothly. Since the bubbles are generated randomly and everywhere, a volume-averaged, two-phase, two-velocity, one pressure-flow model is applied. This fluid system is coupled with a set of convection–diffusion equations for the chemicals subject to flux boundary conditions for electron balance. The moving boundary due to plating is considered. The Galerkin-characteristic finite element method is used for temporal and spatial discretizations; the well-posedness of the numerical scheme is proved. Numerical studies in two dimensions are performed to validate the model against earlier one-dimensional models and a dedicated experiment that has been set up to visualize the distribution of bubbles.
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Submitted on : Wednesday, October 27, 2021 - 11:00:25 AM
Last modification on : Tuesday, November 16, 2021 - 4:03:14 AM


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Po-Yi Wu, Olivier Pironneau, Po-Shao Shih, Chengheng Robert Kao. Numerical Analysis of an Electroless Plating Problem in Gas–Liquid Two-Phase Flow. Fluids, MDPI, 2021, 6 (11), pp.371. ⟨10.3390/fluids6110371⟩. ⟨hal-03405329⟩



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