Magnetron sputtering Selenization CH4 Optical waveguides Ambipolar material X-ray photoelectron spectroscopy A3 Physical vapor deposition processes Transmission electron microscopy TiO2 B2 Semiconducting alloys Rutile Band gap Structure Copper Mott insulator A Multilayers Bipolar resistive switching BRS Non-volatile memory Applications industrielles Resistive switching CIGSe Atomic force microscopy Etching AlN Adsorption CNTs’ collapse Amorphous V2O3 Anatase Avalanche breakdown C Photoelectron spectroscopy Sputtering A Chalcogenides Aryl-diazonium salts B Chemical synthesis Titanium dioxide Bixbyite Chalcogenide Semiconductors Sol-gel Colloidal solution CaTiO3Pr^3^+ Residual stress Plasmas froids Optical properties Mass spectrometry Physical vapor deposition 3 nm in size Transfert d'énergie XPS Plasma etching Thin film Nanocomposite B2 Quaternary Biomembranes Alloying Calcined clay A1 Characterization AuCu alloy Spectroscopic ellipsometry Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation CHLORINE PLASMAS A-CNx Alzheimer's disease Nanotubes Annealing Ablation laser BOMBARDMENT Low-pressure plasma processing Atomic layer etching TEM Carbon Functionalization Films Kirkendall effect B2 Semiconducting indium compounds Biocapteurs Thin films Integrated optics Biofilms microbiens Oxides Capacitance SF 6 B3 Solar cells B1 Inorganic compounds Optical interferometry Carbon Nanotube Aluminium nitride Amyloid precursor PECVD Band alignment Vanadium Sesquioxide A Thin films Mott insulators Scanning electron microscopy NEXAFS AZO thin films X-ray diffraction Buffer Couple Biomasse