Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications

Mamadou Diobet Diop 1, * Vincent Mandrillon 2 Hervé Boutry 3 Karim Inal 1 Roland Fortunier 4, 5
* Auteur correspondant
1 PS2-ENSMSE - Département Packaging et Supports Souples
2 ERC CEA / EMSE - Équipe de Recherche Commune CEA - EMSE (SESAM : Secured Embedded Systems And Microelectronics)
3 CEA-LETI - Laboratoire d'Electronique et des Technologies de l'Information
4 MPM-ENSMSE - Département Microstructures et Propriétés Mécaniques
5 PECM-ENSMSE - Plasticité, Endommagement et Corrosion des Matériaux
Abstract : This paper investigates the mechanical deformation and the electrical contact resistance of an electroplated Ni micro-cylinder called micro-insert inserted in an Al thin film. A modified nanoindentation apparatus is used to perform the experiments with 6 μm, 8.5 μm and 12.5 μm diameters micro-inserts having the same 5 μm height. Mechanical deformation of Ni micro-insert and Al film is described at different maximum loads corresponding to an equivalent stress of 0.8 GPa, 1.6 GPa and 3.2 GPa. At equivalent stress less than 1.6 GPa, Ni micro-insert exhibits an elastic deformation while at 3.2 GPa it presents an elastic–plastic deformation with a large amount of compression and penetration into micro-insert foundation. Visco-plastic deformation of Al film is noticed during hold at all maximum loads. Beside, Al creep parameters are extracted using a combined Maxwell/Kelvin-Voigt phenomenological model. Mechanical results are coupled to electrical contact resistance measurement.
Keywords : Micro-insertion Nickel Aluminium Nanoindenter Elastic–plastic deformation Creep Electrical contact resistance
Type de document :
Article dans une revue
Microelectronic Engineering, Elsevier, 2009, 87 (3), pp.522-526. 〈10.1016/j.mee.2009.07.020〉
Liste complète des métadonnées
https://hal-emse.ccsd.cnrs.fr/emse-00450478
Contributeur : Karim Inal <>
Soumis le : mardi 26 janvier 2010 - 14:35:20
Dernière modification le : lundi 25 février 2019 - 16:34:17

Identifiants

Collections

CEA | PS2-ENSMSE | MPM-ENSMSE | SMS-ENSMSE | PECM-ENSMSE | EMSE | SAS-ENSMSE | CMP-ENSMSE | INSTITUT-TELECOM | DRT | LETI | CEA-GRE

Citation

Mamadou Diobet Diop, Vincent Mandrillon, Hervé Boutry, Karim Inal, Roland Fortunier. Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications. Microelectronic Engineering, Elsevier, 2009, 87 (3), pp.522-526. 〈10.1016/j.mee.2009.07.020〉. 〈emse-00450478〉

Exporter

BibTeX TEI DC DCterms EndNote

Partager

Métriques

Consultations de la notice

203

Contact

support.ccsd.cnrs.fr
hal.support@ccsd.cnrs.fr
Logo CCSD