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Journal Articles Microelectronic Engineering Year : 2009

Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications

Abstract

This paper investigates the mechanical deformation and the electrical contact resistance of an electroplated Ni micro-cylinder called micro-insert inserted in an Al thin film. A modified nanoindentation apparatus is used to perform the experiments with 6 μm, 8.5 μm and 12.5 μm diameters micro-inserts having the same 5 μm height. Mechanical deformation of Ni micro-insert and Al film is described at different maximum loads corresponding to an equivalent stress of 0.8 GPa, 1.6 GPa and 3.2 GPa. At equivalent stress less than 1.6 GPa, Ni micro-insert exhibits an elastic deformation while at 3.2 GPa it presents an elastic–plastic deformation with a large amount of compression and penetration into micro-insert foundation. Visco-plastic deformation of Al film is noticed during hold at all maximum loads. Beside, Al creep parameters are extracted using a combined Maxwell/Kelvin-Voigt phenomenological model. Mechanical results are coupled to electrical contact resistance measurement.

Dates and versions

emse-00450478 , version 1 (26-01-2010)

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Mamadou Diobet Diop, Vincent Mandrillon, Hervé Boutry, Karim Inal, Roland Fortunier. Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications. Microelectronic Engineering, 2009, 87 (3), pp.522-526. ⟨10.1016/j.mee.2009.07.020⟩. ⟨emse-00450478⟩
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