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Journal Articles Components and Package Technologies Year : 2009

A Fluxless and Low-Temperature Flip Chip Process Based on Insertion Technique

Abstract

Abstract: For heterogeneous materials assembly, the thermal expansion mismatch between the chip and the substrate is a roadblock for Hip chip bonding of ultrafine-pitch (<= 10 mu m) and large diagonal devices (>= 20 mm). Residual strains in bumps and device warpage have been calculated to evaluate the thermomechanical limits of a conventional flip chip soldering process using micro bumping. As a solution to overcome these limits, this paper describes a new patented flip-chip technology representing a technological breakthrough compared to conventional methods such as soldering or bonding through conductive adhesives. Electrical connections are performed by the insertion of metallic micro-tips in a ductile material. As a low-temperature process and fluxless technology, this method is adapted to fine-pitch and large devices. As a proof of concept, we present the bonding results obtained on fine-pitch large arrays of daisy chains with 500 x 500 contacts and 30-mu m pitch. The electrical contact has been demonstrated and characterized in terms of resistance and yield.
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Dates and versions

emse-00498450 , version 1 (07-07-2010)

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Manuel Fendler, Cécile Davoine, François Marion, Damien Saint Patrice, Roland Fortunier, et al.. A Fluxless and Low-Temperature Flip Chip Process Based on Insertion Technique. Components and Package Technologies, 2009, 32 (1), pp.207-215. ⟨10.1109/TCAPT.2008.2005099⟩. ⟨emse-00498450⟩
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