A Fluxless and Low-Temperature Flip Chip Process Based on Insertion Technique

Abstract : Abstract: For heterogeneous materials assembly, the thermal expansion mismatch between the chip and the substrate is a roadblock for Hip chip bonding of ultrafine-pitch (<= 10 mu m) and large diagonal devices (>= 20 mm). Residual strains in bumps and device warpage have been calculated to evaluate the thermomechanical limits of a conventional flip chip soldering process using micro bumping. As a solution to overcome these limits, this paper describes a new patented flip-chip technology representing a technological breakthrough compared to conventional methods such as soldering or bonding through conductive adhesives. Electrical connections are performed by the insertion of metallic micro-tips in a ductile material. As a low-temperature process and fluxless technology, this method is adapted to fine-pitch and large devices. As a proof of concept, we present the bonding results obtained on fine-pitch large arrays of daisy chains with 500 x 500 contacts and 30-mu m pitch. The electrical contact has been demonstrated and characterized in terms of resistance and yield.
Type de document :
Article dans une revue
Components and Package Technologies, 2009, 32 (1), pp.207-215. 〈10.1109/TCAPT.2008.2005099〉
Liste complète des métadonnées

https://hal-emse.ccsd.cnrs.fr/emse-00498450
Contributeur : Anna Fraczkiewicz <>
Soumis le : mercredi 7 juillet 2010 - 14:55:22
Dernière modification le : mardi 23 octobre 2018 - 14:36:08

Identifiants

Collections

EMSE | CEA | DRT | LETI

Citation

Manuel Fendler, Cécile Davoine, François Marion, Damien Saint Patrice, Roland Fortunier, et al.. A Fluxless and Low-Temperature Flip Chip Process Based on Insertion Technique. Components and Package Technologies, 2009, 32 (1), pp.207-215. 〈10.1109/TCAPT.2008.2005099〉. 〈emse-00498450〉

Partager

Métriques

Consultations de la notice

192