Low-temperature and pressureless sintering technology for high-performance and hightemperature interconnection of semiconductor devices thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems, Proc International conference on, pp.609-613, 2007. ,
Sintering mechanism of composite nanoparticle and its application to bonding in electronics, Proc Materials Science and Technology Conference, 2006. ,
Thermal behavior of silver nanoparticles for low-temperature interconnect applications, Journal of Electronic Materials, vol.63, issue.2, pp.168-175, 2005. ,
DOI : 10.1007/s11664-005-0229-8
Novel Monolayer-enhanced Non-Conductive Film (NCF) for Ultra-Fine Pitch High Performance Interconnect in Lead-free Electronics, 2007 Proceedings 57th Electronic Components and Technology Conference, pp.1911-1915, 2007. ,
DOI : 10.1109/ECTC.2007.374060
Direct writing of silver conductive patterns: Improvement of film morphology and conductance by controlling solvent compositions, Applied Physics Letters, vol.89, issue.26, pp.264101-264104, 2006. ,
DOI : 10.1063/1.2424671
Size effect on the melting temperature of gold particles, Physical Review A, vol.13, issue.6, pp.2287-2298, 1976. ,
DOI : 10.1103/PhysRevA.13.2287
Modelling the size effect on the melting temperature of nanoparticles, nanowires and nanofilms, Journal of Physics: Condensed Matter, vol.19, issue.21, p.216216, 2007. ,
DOI : 10.1088/0953-8984/19/21/216216
All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles, Nanotechnology, vol.18, issue.34, pp.345202-345209, 2007. ,
DOI : 10.1088/0957-4484/18/34/345202
Ink-jet Printing and Microwave Sintering of Conductive Silver Tracks, Advanced Materials, vol.30, issue.16, pp.2101-2104, 2006. ,
DOI : 10.1002/adma.200502422
Electrical sintering of nanoparticle structures, Nanotechnology, vol.19, issue.17, p.175201, 2008. ,
DOI : 10.1088/0957-4484/19/17/175201
Mechanical properties of porous and fully dense low-?? dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique, Journal of Materials Research, vol.21, issue.02, pp.386-395, 2006. ,
DOI : 10.1557/JMR.1993.1542
Size effect on the melting temperature of gold particles, Physical Review A, vol.13, issue.6, pp.2287-2298, 1976. ,
DOI : 10.1103/PhysRevA.13.2287
Small particle melting of pure metals, Thin Solid Films, vol.144, issue.2, pp.297-308, 1986. ,
DOI : 10.1016/0040-6090(86)90422-0
Sintering Theory and Practice, 1996. ,
A second report on sintering diagrams, Acta Metallurgica, vol.29, issue.2, pp.259-281, 1981. ,
DOI : 10.1016/0001-6160(81)90154-1
The size effect and the non-local Boltzmann transport equation in orifice and disk geometry, Proc. Phys. Soc, pp.927-941, 1966. ,
DOI : 10.1088/0370-1328/89/4/316
Thermal optimization of silver nanoparticles sintering for low resistive printed applications, Proc 20 th MicroMechanics Europe Workshop, pp.368-371, 2009. ,
URL : https://hal.archives-ouvertes.fr/emse-00466405
Mechanical characterization of solution-derived nanoparticle silver ink thin films, Journal of Applied Physics, vol.101, issue.10, pp.103529-103564, 2007. ,
DOI : 10.1063/1.2735404
A simple guide to determine elastic properties of films on substrate from nanoindentation experiments, Philosophical Magazine, vol.213, issue.33-35, pp.33-35, 2006. ,
DOI : 10.1080/14786430600660856
URL : https://hal.archives-ouvertes.fr/hal-00123591
Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface, Microelectronics Reliability, vol.44, issue.6, pp.993-1007, 2004. ,
DOI : 10.1016/j.microrel.2004.01.001