Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling - Mines Saint-Étienne
Conference Papers Year : 2010

Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling

Romuald Roucou
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Département Packaging et Supports Souples
STMicroelectronics [Crolles]
Vincent Fiori
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  • PersonId : 881779
STMicroelectronics [Crolles]
Karim Inal
Département Packaging et Supports Souples
CV
Hervé Jaouen
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STMicroelectronics [Crolles]

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Mechanics of materials [physics.class-ph] Mechanics of materials [physics.class-ph] Micro and nanotechnologies/Microelectronics

Karim Inal  : Connect in order to contact the contributor

https://hal-emse.ccsd.cnrs.fr/emse-00533813

Submitted on : Monday, November 8, 2010-1:13:03 PM

Last modification on : Tuesday, September 17, 2024-3:45:08 PM

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emse-00533813 , version 1 (08-11-2010)

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Romuald Roucou, Vincent Fiori, Karim Inal, Hervé Jaouen. Mechanical Issues Induced by Electrical Wafer Sort: Correlations from actual tests, Nanoindentation and 3D Dynamic Modeling. Electronics System Integration Technology Conference ESTC 2010, Sep 2010, Berlin, Germany. pp.P0027, ⟨10.1109/ESTC.2010.5642863⟩. ⟨emse-00533813⟩

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