J. Szczech, C. Megaridis, D. Gamota, and J. Zhang, Fine-line conductor manufacturing using drop-on demand PZT printing technology, IEEE Transactions on Electronics Packaging Manufacturing, vol.25, issue.1, p.26, 2002.
DOI : 10.1109/TEPM.2002.1000480

V. Pekkanen, M. Mäntysalo, K. Kaija, P. Mansikkamäki, E. Kunnari et al., Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package, Microelectronic Engineering, vol.87, issue.11, p.2382, 2010.
DOI : 10.1016/j.mee.2010.04.013

J. Kim, Y. Lee, J. Kim, W. Nah, H. Lee et al., Characterization of direct patterned Ag circuits for RF application, Microelectronic Engineering, vol.87, issue.3, p.379, 2010.
DOI : 10.1016/j.mee.2009.06.012

T. Castro, R. Reifenberger, E. Choi, and R. P. Andres, Size-dependent melting temperature of individual nanometer-sized metallic clusters, Physical Review B, vol.42, issue.13, p.8548, 1990.
DOI : 10.1103/PhysRevB.42.8548

P. Buffat and J. Borel, Size effect on the melting temperature of gold particles, Physical Review A, vol.13, issue.6, p.2287, 1976.
DOI : 10.1103/PhysRevA.13.2287

J. Perelaer, M. Klokkenburg, C. E. Hendriks, and U. S. Schubert, Microwave Flash Sintering of Inkjet-Printed Silver Tracks on Polymer Substrates, Advanced Materials, vol.15, issue.47, p.4830, 2009.
DOI : 10.1002/adma.200901081

A. Chiolerio, G. Maccioni, P. Martino, M. Cotto, P. Pandolfi et al., Inkjet printing and low power laser annealing of silver nanoparticle traces for the realization of low resistivity lines for flexible electronics, Microelectronic Engineering, vol.88, issue.8, p.2481, 2011.
DOI : 10.1016/j.mee.2010.12.099

J. R. Greer and R. A. Street, Thermal cure effects on electrical performance of nanoparticle silver inks, Acta Materialia, vol.55, issue.18, p.6345, 2007.
DOI : 10.1016/j.actamat.2007.07.040

M. Gupta, E. Leong, W. Wong, R. Roy, D. Agrawal et al., Microwaves and metals, Nature, vol.399, p.668, 1999.
DOI : 10.1002/9780470822746

S. Takayama, G. Link, S. Miksch, M. Sato, J. Ichikawa et al., Millimetre wave effects on sintering behaviour of metal powder compacts, Powder Metallurgy, vol.111, issue.3, p.274, 2006.
DOI : 10.1109/27.772284

C. Gabriel, S. Gabriel, E. H. Grant, E. H. Grant, B. S. Halstead et al., Dielectric parameters relevant to microwave dielectric heating, Chemical Society Reviews, vol.29, issue.3, p.213, 1998.
DOI : 10.1039/a827213z

J. Greiser, P. Müllner, and E. Arzt, Abnormal growth of ???giant??? grains in silver thin films, Acta Materialia, vol.49, issue.6, p.1041, 2001.
DOI : 10.1016/S1359-6454(00)00372-4

D. Lide, CRC handbook of chemistry and physics, 2000.

A. F. Mayadas and M. Shatzkes, Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces, Physical Review B, vol.1, issue.4, p.1382, 1970.
DOI : 10.1103/PhysRevB.1.1382

X. Chen, Y. Xiang, and J. J. Vlassak, Novel technique for measuring the mechanical properties of porous materials by nanoindentation, Journal of Materials Research, vol.455, issue.03, p.715, 2006.
DOI : 10.1115/1.3443401

L. J. Gibson and M. F. Ashby, Cellular solids: structure and properties, Cambridge solid state science series, 1999.
DOI : 10.1017/CBO9781139878326

A. J. Birnbaum, K. J. Wahl, R. C. Auyeung, and A. Piqué, Nanoporosity-induced effects on Ag-based metallic nano-inks for non-lithographic fabrication, Journal of Micromechanics and Microengineering, vol.20, issue.7, p.77002, 2010.
DOI : 10.1088/0960-1317/20/7/077002

W. C. Oliver and G. M. Pharr, An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, Journal of Materials Research, vol.XI, issue.06, p.1564, 1992.
DOI : 10.1557/JMR.1992.0613