G. Q. Lu, Low-temperature and pressureless sintering technology for high- performance and high-temperature interconnection of semiconductor devices thermal, mechanical and multi-physics simulation experiments in microelectronics and microsystems, Proc International conference on, pp.609-613, 2007.

T. Yamaguchi, Sintering mechanism of composite nanoparticle and its application to bonding in electronics, Proc Materials Science and Technology Conference, 2006.

K. S. Moon, Thermal behavior of silver nanoparticles for low-temperature interconnect applications, Journal of Electronic Materials, vol.63, issue.2, pp.168-175, 2005.
DOI : 10.1007/s11664-005-0229-8

Y. Xiang, Mechanical properties of porous and fully dense low-?? dielectric thin films measured by means of nanoindentation and the plane-strain bulge test technique, Journal of Materials Research, vol.21, issue.02, pp.386-395, 2006.
DOI : 10.1557/JMR.1993.1542

R. Cauchois, Wire-bonding on inkjetprinted silver pads reinforced by electroless plating for chip on flexible board packages, Proc IEEE Electronic System-Integration Technology Conference, 2010.
URL : https://hal.archives-ouvertes.fr/emse-00530148

P. Buffat and J. Borel, Size effect on the melting temperature of gold particles, Physical Review A, vol.13, issue.6, pp.2287-2298, 1976.
DOI : 10.1103/PhysRevA.13.2287

G. Allen, Small particle melting of pure metals, Thin Solid Films, vol.144, issue.2, pp.297-308, 1986.
DOI : 10.1016/0040-6090(86)90422-0

G. Wexler, The size effect and the non-local Boltzmann transport equation in orifice and disk geometry, Proc. Phys. Soc, pp.927-941, 1966.
DOI : 10.1088/0370-1328/89/4/316

S. H. Ko, All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles, Nanotechnology, vol.18, issue.34, pp.345202-345209, 2007.
DOI : 10.1088/0957-4484/18/34/345202

J. Perelaer, Ink-jet Printing and Microwave Sintering of Conductive Silver Tracks, Advanced Materials, vol.30, issue.16, pp.2101-2104, 2006.
DOI : 10.1002/adma.200502422

M. L. Allen, Electrical sintering of nanoparticle structures, Nanotechnology, vol.19, issue.17, p.175201, 2008.
DOI : 10.1088/0957-4484/19/17/175201

J. R. Greer and R. A. Street, Mechanical characterization of solution-derived nanoparticle silver ink thin films, Journal of Applied Physics, vol.101, issue.10, pp.103529-103564, 2007.
DOI : 10.1063/1.2735404