T. Someya, T. Sekitani, M. Takamiya, T. Sakurai, U. Zschieschang et al., Printed organic transistors: Toward ambient electronics, 2009 IEEE International Electron Devices Meeting (IEDM), pp.4-6, 2008.
DOI : 10.1109/IEDM.2009.5424430

J. M. Verilhac, M. Benwadih, A. L. Seiler, and S. Jacob, Step toward robust and reliable amorphous polymer field-effect transistors and logic functions made by the use of roll to roll compatible printing processes, Organic Electronics, vol.11, issue.3, pp.456-562, 2010.
DOI : 10.1016/j.orgel.2009.11.027
URL : https://hal.archives-ouvertes.fr/hal-00569811

A. N. Gent and G. R. Hamed, Peel mechanics for an elastic-plastic adherend, Journal of Applied Polymer Science, vol.21, issue.10, pp.2817-2831, 1977.
DOI : 10.1002/app.1977.070211018

M. D. Thouless and H. M. Jensen, Elastic Fracture Mechanics of the Peel-Test Geometry, The Journal of Adhesion, vol.13, issue.3-4, pp.185-197, 1992.
DOI : 10.1016/0020-7683(89)90096-6

Y. H. Lai and D. A. Dillard, A Comparison of Energy Release Rates in Different Membrane Blister and Peel Tests, The Journal of Adhesion, vol.13, issue.1-4, pp.59-78, 1996.
DOI : 10.1016/0020-7683(71)90001-1

C. T. Sun and W. Qian, The use of finite extension strain energy release rates in fracture of interfacial cracks, International Journal of Solids and Structures, vol.34, issue.20, pp.2595-2609, 1997.
DOI : 10.1016/S0020-7683(96)00157-6

H. Yu and J. W. Hutchinson, Delamination of thin film strips, Thin Solid Films, vol.423, issue.1, pp.54-63, 2003.
DOI : 10.1016/S0040-6090(02)00973-2

R. H. Dauskardt, M. Lanea, Q. Mab, and N. Krishnac, Adhesion and debonding of multi-layer thin film structures, Engineering Fracture Mechanics, vol.61, issue.1, pp.141-162, 1998.
DOI : 10.1016/S0013-7944(98)00052-6

H. M. Jensen and M. D. Thouless, Effects of residual stresses in the blister test, International Journal of Solids and Structures, vol.30, issue.6, pp.779-795, 1993.
DOI : 10.1016/0020-7683(93)90040-E

]. D. Hegemann, H. Brunner, and C. Oehr, Plasma treatment of polymers for surface and adhesion improvement, Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, vol.208, pp.281-286, 2003.
DOI : 10.1016/S0168-583X(03)00644-X

]. D. Boudinet, M. Benwadih, S. Altazin, R. Gwoziecki, J. M. Verilhac et al., Influence of the semi-conductor layer thickness on electrical performance of staggered n- and p-channel organic thin-film transistors, Organic Electronics, vol.11, issue.2, pp.291-298, 2010.
DOI : 10.1016/j.orgel.2009.11.008

]. N. Savvides and T. J. Bell, Hardness and elastic modulus of diamond and diamond-like carbon films, Thin Solid Films, vol.228, issue.1-2, pp.289-292, 1993.
DOI : 10.1016/0040-6090(93)90618-Y

X. Boddaert, B. Bensaid, P. Benaben, R. Gwoziecki, and R. , Mechanical and thermal reliability of printed organic thin-film transistor, Microelectronics Reliability, vol.50, issue.9-11, pp.1884-1887, 2010.
DOI : 10.1016/j.microrel.2010.07.018
URL : https://hal.archives-ouvertes.fr/emse-00577055

A. Abdul-baqi and E. Van-der-giessen, Numerical analysis of indentation-induced cracking of brittle coatings on ductile substrates, International Journal of Solids and Structures, vol.39, issue.6, pp.1427-1442, 2002.
DOI : 10.1016/S0020-7683(01)00280-3

M. Barletta, A. Gisario, L. Lusvarghiu, G. Bolleli, and G. Cubino, On the combined use of scratch tests and CLA profilometry for the characterization of polyester powder coatings: Influence of scratch load and speed, Applied Surface Science, vol.254, issue.22, pp.7198-7214, 2008.
DOI : 10.1016/j.apsusc.2008.05.315

V. L. Houerou, C. Gauthier, and R. Schirrer, Mechanical analysis of the blistering of a thin film deposited on a glassy polymer, Tribology International, vol.43, issue.1-2, pp.129-135, 2010.
DOI : 10.1016/j.triboint.2009.05.011