Skipping algorithms for defect inspection using a dynamic control strategy in semiconductor manufacturing

Abstract : In this paper, we propose new ways for efficiently managing defect inspection queues in semiconductor manufacturing when a dynamic sampling strategy is used. The objective is to identify lots that can skip the inspection operation, i.e. lots that have limited impact on the risk level of process tools. The risk considered in this paper, called Wafer at Risk (W@R), is the number of wafers processed on a process tool between two defect inspection operations. An indicator (GSI, Global Sampling Indicator) is used to evaluate the overallW@R and another associated indicator (LSI, Lot Scheduling Indicator) is used to identify the impact on the overall risk if a lot is not measured. Based on these indicators, five new algorithms are proposed and tested with industrial instances. Results show the relevance of our approach and that evaluating sets of lots for skipping performs better than evaluating lots individually.
Type de document :
Communication dans un congrès
MASM 2013 (9th International Conference on Modeling and Analysis of Semiconductor Manufacturing), included in the 2013 Winter Simulation Conference., Dec 2013, Washington, United States. pp.3684 - 3695, 2013
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https://hal-emse.ccsd.cnrs.fr/emse-01003743
Contributeur : Gloria Luz Rodriguez Verjan <>
Soumis le : mardi 10 juin 2014 - 15:42:53
Dernière modification le : mardi 22 mars 2016 - 01:16:23

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  • HAL Id : emse-01003743, version 1

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Gloria Luz Rodriguez Verjan, Stéphane Dauzère-Pérès, Sylvain Housseman, Jacques Pinaton. Skipping algorithms for defect inspection using a dynamic control strategy in semiconductor manufacturing. MASM 2013 (9th International Conference on Modeling and Analysis of Semiconductor Manufacturing), included in the 2013 Winter Simulation Conference., Dec 2013, Washington, United States. pp.3684 - 3695, 2013. 〈emse-01003743〉

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