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Effect of Packaging Design on Wire Bond Interconnection Reliability

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https://hal-emse.ccsd.cnrs.fr/emse-00470634
Contributor : Karim Inal <>
Submitted on : Wednesday, April 7, 2010 - 10:46:07 AM
Last modification on : Wednesday, June 24, 2020 - 4:18:20 PM

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  • HAL Id : emse-00470634, version 1

Citation

Man Su, Karim Inal, Xavier Boddaert. Effect of Packaging Design on Wire Bond Interconnection Reliability. ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France. ⟨emse-00470634⟩

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