Effect of Packaging Design on Wire Bond Interconnection Reliability - Mines Saint-Étienne Access content directly
Conference Papers Year : 2009

Effect of Packaging Design on Wire Bond Interconnection Reliability

Man Su
  • Function : Author
  • PersonId : 868642
Karim Inal
Xavier Boddaert
  • Function : Author
  • PersonId : 868640
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emse-00470634 , version 1 (07-04-2010)

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  • HAL Id : emse-00470634 , version 1

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Man Su, Karim Inal, Xavier Boddaert. Effect of Packaging Design on Wire Bond Interconnection Reliability. ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France. ⟨emse-00470634⟩
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