Conference Papers
Year : 2009
Karim Inal : Connect in order to contact the contributor
https://hal-emse.ccsd.cnrs.fr/emse-00470634
Submitted on : Wednesday, April 7, 2010-10:46:07 AM
Last modification on : Tuesday, September 17, 2024-3:45:45 PM
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- HAL Id : emse-00470634 , version 1
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Man Su, Karim Inal, Xavier Boddaert. Effect of Packaging Design on Wire Bond Interconnection Reliability. ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France. ⟨emse-00470634⟩
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