Diffusion-Controlled Liquid Bismuth Induced Intergranular Embrittlement of Copper

Vincent Laporte 1, 2 Krzysztof Wolski 1, 2 Pascal Berger 3 Anne Terlain 4 Gérard Santarini 5
1 MPI-ENSMSE - Département Mécanique physique et interfaces
2 PECM-ENSMSE - Plasticité, Endommagement et Corrosion des Matériaux
3 LPS - Laboratoire Pierre Süe
4 SCCME - Service de la Corrosion et du Comportement des Matériaux dans leur Environnement
DPC - Département de Physico-Chimie : DEN/DPC/SCCME
5 DPC - Département de Physico-Chimie
Abstract : The consequences of the contact between liquid bismuth and a copper bicrystal are investigated at 500°C. Atoms of bismuth are shown to penetrate and embritlle the copper grain boundary. Grain boundary concentration profiles of bismuth are obtained on fracture surfaces by both Auger electron spectroscopy and He4+ Rutherford backscattering spectroscopy. The maximum bismuth intergranular concentration is calculated from experimental data to be about 1.7 monolayers (near the liquid bismuth / solid copper interface). The overall profiles are significantly different from typical erfc profiles and an interpretation is proposed, based on the coupling effect between grain boundary diffusion and non-linear segregation. These results allow us to conclude on the absence of grain boundary wetting for the Cu / Bi system at 500°C.
Keywords : Auger Electron Spectroscopy (AES) Grain Boundary Diffusion Grain Boundary Wetting Liquid Bismuth System Liquid Metal Embrittlement LME Non Linear Segregation Rutherford Backscattering Spectroscopy RBS Solid Copper
Type de document :
Article dans une revue
Defect and Diffusion Forum, Trans Tech Publications, 2005, 237-240, pp.683-688. 〈10.4028/www.scientific.net/DDF.237-240.683〉
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https://hal-emse.ccsd.cnrs.fr/emse-00506129
Contributeur : Pierre Charles Pinoli <>
Soumis le : mardi 27 juillet 2010 - 12:50:31
Dernière modification le : mardi 23 octobre 2018 - 14:36:04

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Vincent Laporte, Krzysztof Wolski, Pascal Berger, Anne Terlain, Gérard Santarini. Diffusion-Controlled Liquid Bismuth Induced Intergranular Embrittlement of Copper. Defect and Diffusion Forum, Trans Tech Publications, 2005, 237-240, pp.683-688. 〈10.4028/www.scientific.net/DDF.237-240.683〉. 〈emse-00506129〉

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