The effect of thermal profile on microstructure is studied in the frame of thin films deposited by inkjet-printing technology. The role of sintering temperature and thermal ramp is particularly investigated. Fast heating ramps exhibit coarse grains and pores, especially when a hybrid microwave curing is performed. This enhanced growth is attributed to the quick activation of densifying sintering regimes without undergoing thermal energy loss at low temperature. Microstructural evolution of various sintered inkjet-printed films is correlated with electrical resistivity and with the Young's modulus determined by nanoindentation. A strong link between those three parameters is highlighted during experiments giving credit to either a surface or a fully volumetric sintering, according to the process. Sintering is then mainly triggered by surface mass transfer or by grain boundary diffusion respectively. Silver thin-films with an electrical resistivity 4 to 5 times higher than the bulk has been reached in a few minutes and with a Young's modulus of 38 GPa.