Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages

Romain Cauchois 1, 2 Mohamed Saadaoui 2 Jacques Legeleux 2 Thierry Malia 1 Béatrice Dubois-Bonvalot 1 Karim Inal 2 Jean-Christophe Fidalgo 1
1 IMT - Innovation and Manufacturing Technologies
2 PS2-ENSMSE - Département Packaging et Supports Souples
Abstract : Inkjet-printing of interconnects is a maskless technology that has attracted great interest for printed electronics and packaging applications. Gemalto is expecting by motivated and developing skills and knowledge in this area to be at the forefront of European Security innovation and to answer to a continuous market pressure for higher security, lower cost and more secure complex systems. With an increasing need for flexible and mass deliveries of advanced secure personal devices such as: electronic passports, ID cards, driver licenses, other smartcards, e-documents and tokens. EMSE is seeing in these new developments an exciting brand new area of research situated between material science and electronics. In this frame, deposit and pattern creation for chip interconnection require specific behaviors which have to be scientifically understood to pursue industrial harmonious implementation. Both groups collaborated on inkjet-printed electronic routing from deposition to sintering and characterization, using collaborative means provided on Micro-PackS platform.
Keywords : Inkjet-printing flexible electronics chip interconnection electroless conductive nanoparticles routing
Type de document :
Communication dans un congrès
MiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01, 2012
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Contributeur : Romain Cauchois <>
Soumis le : mardi 2 octobre 2012 - 11:26:28
Dernière modification le : mercredi 29 novembre 2017 - 10:08:08
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Romain Cauchois, Mohamed Saadaoui, Jacques Legeleux, Thierry Malia, Béatrice Dubois-Bonvalot, et al.. Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages. MiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01, 2012. 〈emse-00691806〉

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