Romain Cauchois, Mohamed Saadaoui, Jacques Legeleux, Thierry Malia, Béatrice Dubois-Bonvalot, et al.. Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages.
MiNaPAD 2012. Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum, Apr 2012, Grenoble, France. pp.F01.
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