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Journal Articles IEEE Transactions on Semiconductor Manufacturing Year : 2013

A literature review on sampling techniques in semiconductor manufacturing

Abstract

This paper reviews sampling techniques for inspectionin semiconductor manufacturing. We discuss the strengthsand weaknesses of techniques developed in the last last 20 yearsfor excursion monitoring (when a process or machine falls outof specifications) and control. Sampling techniques are classifiedinto three main groups: static, adaptive, and dynamic. Foreach group, a classification is performed per year, approach,and industrial deployment. A comparison between the groupsindicates a complementarity strongly linked to the semiconductorenvironment. Benefits and drawbacks of each group are discussed,showing significant improvements from static to dynamicthrough adaptive sampling techniques. Dynamic sampling seemsto be more appropriate for modern semiconductor plants.
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Dates and versions

emse-01095720 , version 1 (16-12-2014)

Identifiers

  • HAL Id : emse-01095720 , version 1

Cite

Justin Ndhuhura-Munga, Gloria Rodriguez-Verjan, Stéphane Dauzere-Peres, Claude Yugma, Philippe Vialletelle, et al.. A literature review on sampling techniques in semiconductor manufacturing. IEEE Transactions on Semiconductor Manufacturing, 2013, 26 (2), pp.188-195. ⟨emse-01095720⟩
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