LED Failure Localization Method due to Thermal Shock and Residual Stress Impact - Mines Saint-Étienne
Conference Papers Year : 2018

LED Failure Localization Method due to Thermal Shock and Residual Stress Impact

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Géraldine Fournier-Moulin  : Connect in order to contact the contributor

https://hal-emse.ccsd.cnrs.fr/emse-02016680

Submitted on : Tuesday, February 12, 2019-7:07:01 PM

Last modification on : Tuesday, September 17, 2024-3:45:10 PM

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emse-02016680 , version 1 (12-02-2019)

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  • HAL Id : emse-02016680 , version 1

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S. Nocairi, C. Roucoules, S. Sao-Joao, G. Kermouche, H. Klöcker. LED Failure Localization Method due to Thermal Shock and Residual Stress Impact. 2018 7th Electronic System-Integration Technology Conference (ESTC), Sep 2018, Dresden, Germany. pp.1-6. ⟨emse-02016680⟩

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