Elaboration and Properties of Carbon Fibre Reinforced Copper Matrix Composites
Résumé
Carbon fibres reinforced copper matrix composites (Cu/C composites) offer an excellent
thermal conductivity and a low coefficient of thermal expansion. Then, these composites are
compromising heat dissipation materials for electronic application.
The modern electronic devices consist of a variety of metallic, ceramic, plastic or composite
components. The large difference of coefficient of thermal expansion (CTE) between ceramic
substrates, such as Al2O3 and AlN, and heat dissipation materials, such as Cu and Al, and Si
and GaAs semiconductors, induces thermal stresses resulting in failures at the interfaces
between the different layers of the devices (fig. 1). In high power dissipation packages,
thermal management is an important issue to prevent thermal damage of sensitive
components on the silicon ship, especially for high density electronic packaging. Thermal
management is thus one of the critical aspects in design of multichip modules to ensure
reliability of electronic devices with high packing and power densities. In this context, there
is an increasing demand of new heat dissipation materials having low CTE combined with
high thermal conductivity, such as Cu/C composites.
Domaines
MatériauxOrigine | Publication financée par une institution |
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